scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 80C451 CMOS I/O expanded microcontroller 02 83C451 CMOS I/O expanded microcontroller with a one time programmable EPROM.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X D-13 (64-lead, 3.240" × 0.920" × 0.225"), dual-in-line package U C-7 (68-terminal, 0.962" × 0.962" × 0.120"), square chip carrier M C-J2 (68-terminal, 0.958" × 0.958" × 0.190"), square leaded chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Maximum power dissipation - - - - - - - - - - - - - - - - - 200 mW Voltage range from V_CC to V_SS - - - - - - - - - - - - - - - −0.5 V dc to +6.5 V dc Voltage range from any pin to V_SS- - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Storage temperature range- - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 5 seconds)- - - - - - - - - - - +300°C Maximum junction temperature (T_J)- - - - - - - - - - - - - - 200°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - See MIL-M-38510, appendix C Data retention for device type 02 - - - - - - - - - - - - - 10 years minimum

Supply voltage range (_VCC) - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Case operating temperature range (T_C)- - - - - - - - - - - - −55°C to +125°C Maximum low level input voltage (except [E bar][A bar])- - - - - - - - - 0.2 V_CC − 0.25 V dc Maximum low level input voltage ([E bar][A bar]) - - - - - - - - - - - - 0.2 V_CC − 0.45 V dc Minimum high level input voltage (except XTAL1, RST) - - - - 0.2 V_CC + 1.1 V dc Minimum high level input voltage (XTAL1, RST)- - - - - - - - 0.7 V_CC dc +0.2 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - XX percent 2/

intended Use: