scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 29C861 High performance CMOS 10-bit bus transceiver 02 29C863 High performance CMOS 9-bit bus transceiver 03 29C961 High performance CMOS 10-bit bus transceiver (rotated die) 1/ 04 29C963 High performance CMOS 9-bit bus transceiver (rotated die) 1/ 05 29C861A High performance CMOS 10-bit bus transceiver 06 29C863A High performance CMOS 9-bit bus transceiver

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to 6.0 V dc DC output voltage range - - - - - - - - - - - - - - - −0.5 V dc to 6.0 V dc DC output diode current: into output - - - - - - - - +50 mA DC output diode current: out of output - - - - - - - −50 mA DC input diode current: into input - - - - - - - - - +20 mA DC input diode current: out of input - - - - - - - - −20 mA DC output current per pin: I_SINK Device types 01-04 - - - - - - - - - - - - - - - - +48 mA (2 × I_OL) Device types 05, 06 - - - - - - - - - - - - - - - - +100 mA (2 × I_OL) DC output current per pin: I_SOURCE Device types 01-04 - - - - - - - - - - - - - - - - −30 mA (2 × I_OH) Device types 05, 06 - - - - - - - - - - - - - - - - −100 mA (2 × I_OH) Total dc ground current - - - - - - - - - - - - - - - (n × I_OL + m × I_CCT) mA 2/ Total dc V_CC current- - - - - - - - - - - - - - - - - (n × I_OH + m × I_CCT) mA 2/ Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation, (P_D) 3/- - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds)- - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC): Cases K, L, and 3 - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - +150°C

Supply voltage range (V_CC) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Minimum high-level input voltage (V_IH)- - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - - .8 V dc Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

intended Use: