CENELEC - EN 60191-4
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
inactive
| Organization: | CENELEC |
| Publication Date: | 1 October 1999 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
March 1, 2014
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
October 1, 1999
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 1999
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
EN 60191-4
October 1, 1999
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 1999
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.