NPFC - MIL-A-87135
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
inactive
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| Organization: | NPFC |
| Publication Date: | 16 February 1979 |
| Status: | inactive |
| Page Count: | 7 |
scope:
This specification establishes requirements for a moderately fast curing adhesive used for bonding components to printed-wiring assemblies to prevent vibration damage.
intended Use:
These adhesives are intended to be used for the bonding of components to printed-wiring assemblies.
Document History
March 17, 2010
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
A description is not available for this item.
December 31, 1997
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
A description is not available for this item.
January 20, 1989
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
A description is not available for this item.
MIL-A-87135
February 16, 1979
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
This specification establishes requirements for a moderately fast curing adhesive used for bonding components to printed-wiring assemblies to prevent vibration damage.