scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 D469AA Quad high current power driver

The device class designator shall be a single Letter identifying the product assurance Level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V+) . . . . . . . . . . . . . . . . . . 18 V dc Digital input voltage . . . . . . . . . . . . . . . . . −0.3 V dc to (V+ + 0.3 V dc) Output current . . . . . . . . . . . . . . . . . . . . 1.5 A DC continuous current on any output . . . . . . . . . . 100 mA AC time average current . . . . . . . . . . . . . . . . 100 mA Power dissipation (P_D), T_A = 50°C 2/ . . . . . . . . . 825 mW Thermal resistance, junction-to-case (θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA) . . . . . 91°C/W Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 seconds) . . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C

Operating ambient temperature range (T_A) . . . . . . . −55°C to +125°C Supply voltage (V+) . . . . . . . . . . . . . . . . . . 15 V dc

intended Use: