DLA - SMD-5962-93164
MICROCIRCUIT, LINEAR, 12-BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 11 May 1993 |
| Status: | inactive |
| Page Count: | 20 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-I-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 AD1674 12-Bit A/D Converter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
VCC to digital common. . . . . . . . . . . . . . . . . +16.5 V VEE to digital common. . . . . . . . . . . . . . . . . . −16.5 V VLOGIC to digital common . . . . . . . . . . . . . . . . +7 V Analog common to digital common. . . . . . . . . . . . . ±1.0 V Control inputs (CE, [C bar][S bar], AO, 12/[8 bar], R/[C bar]) to digital common −0.5 V to VLOGIC +0.5 V Analog inputs (REF IN, BIP OFF, 10 VIN) to analog common..VEE to VCC 20 VIN to analog common. . . . . . . . . . . . . . . . . VEE to +24 V REF OUT. . . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Common Momentary Shop, to VCC Power dissipation (PD) . . . . . . . . . . . . . . . . . 825 mW Storage temperature range. . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature (soldering 10 sec). . . . . . . . . . . 300°C Thermal resistance, junction-to-case (θJC) . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA) . . . . . 60°C/W Junction temperature (TJ) . . . . . . . . . . . . . . . +175°C
Ambient operating temperature range (TA). . . . . . . . −55°C to 125°C Operating voltage range: VCC to digital common . . . . . . . . . . . . . . . +11.4 V dc to +16.5 V dc VEE to digital common . . . . . . . . . . . . . . . −11.4 V dc to −16.5 V dc VLOGIC to digital common.. . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc
intended Use:
Microcircuit conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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