scope:

This document is intended to cover all aspects, both method and degree, of cleaning associated with the preparation of bare printed circuit boards prior to solder mask application. It continues with the prudent control of the cleanliness level during the solder mask application and cure processes. It includes maintenance of the cleanliness level of solder masked boards during pre-assembly processes and/or storage time prior to assembly. Finally, based on the procedures used in the previous steps, it deals with maintaining the soldered assembly at a degree of cleanliness consistent with the end use.