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IPC-2516

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description [BDASM]

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Organization: IPC
Publication Date: 1 November 2000
Status: active
Page Count: 19
scope:

This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

The information can be used for both manual and for digital interpretations. The data may be defined in either English or SI units.

Interpretation

"Shall", the emphatic form of the verb, is used throughout this standard whenever a requirement is intended to express a provision that is mandatory. Deviation from a shall requirement is not permitted, and compliance test modules (CTMs) developed to check syntax and semantics, will prompt the user to correct the ambiguity, or to insert missing information.

The words "should" and "may" are used whenever it is necessary to express non-mandatory provisions.

"Will" is used to express a declaration of purpose.

To assist the reader, the word shall is presented in bold characters.

Assembled Board Product Manufacturing Focus

The GenCAM format requirements are provided in a series of standards focused on printed circuit board manufacturing, assembly, inspection, and testing. This standard (IPC-2516) provides information on assembled board manufacturing requirements. The generic standard (IPC-2511) contains general requirements and is a mandatory part of the requirements of this standard, and provides general information necessary to completely understand the GenCAM structure.

Document History

IPC-2516
November 1, 2000
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description [BDASM]
This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed...

References

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