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IEC 60249-3-1

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

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Organization: IEC
Publication Date: 1 January 1981
Status: inactive
Page Count: 24
ICS Code (Printed circuits and boards): 31.180

Document History

IEC 60249-3-1
January 1, 1981
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
A description is not available for this item.

References

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