IEC 60249-3-1
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
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| Organization: | IEC |
| Publication Date: | 1 January 1981 |
| Status: | inactive |
| Page Count: | 24 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
IEC 60249-3-1
January 1, 1981
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
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