scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 32 Dual in-line Y CQCC1-N44 44 Rectangular chip carrier Z See figure 1 32 Flat package U CQCC1-N32 32 Rectangular chip carrier T See figure 1 30 Grid array W See figure 1 36 Grid array

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc 3/ Operating case temperature range - - - - - - - - - - −55°C to +125°C Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC): Cases Y and U - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Cases X, T, and W - - - - - - - - - - - - - - - - 21°C/W 4/ Case Z - - - - - - - - - - - - - - - - - - - - - - 18°C/W 4/ Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 watts Junction temperature (T_J) - - - - - - - - - - - - - - +175°C 5/ Endurance - - - - - - - - - - - - - - - - - - - - - - 10,000 cycles/byte (minimum) Data retention - - - - - - - - - - - - - - - - - - - 20 years minimum

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Supply voltage (V_SS) - - - - - - - - - - - - - - - - 0.0 V dc High level input voltage range (V_IH) - - - - - - - - 2.0 V dc to V_CC + 1.0 V dc Low level input voltage range (V_IL) - - - - - - - - - −0.1 V dc to 0.8 V dc Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - 6/ percent

intended Use: