IPC - TM-650 2.3.23B
Cure (Permanency) Thermally Cured Solder Masks
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 February 1988 |
| Status: | inactive |
| Page Count: | 1 |
scope:
This test method covers the cure, or permanence, testing of thermally cured solder mask (solder resist) organic coatings. Solder masking is the application of either a liquid film or dry film coating on all types of laminates and circuits. The coating is applied where no solder is to appear and, conversely, is omitted where soldering is intended.
Document History
TM-650 2.3.23B
February 1, 1988
Cure (Permanency) Thermally Cured Solder Masks
This test method covers the cure, or permanence, testing of thermally cured solder mask (solder resist) organic coatings. Solder masking is the application of either a liquid film or dry film coating...