scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This Specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. Part 6-2 of ES 59008 specifies the dictionary for die data of all necessary die properties according to the requirements of IEC 61360.