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JEDEC JESD 22-B105

Test Method B105-B Lead Integrity

inactive
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Organization: JEDEC
Publication Date: 1 January 1999
Status: inactive
Page Count: 16

Document History

February 1, 2018
Lead Integrity
This test method provides various test conditions for determining the integrity of the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly processing...
February 1, 2018
Lead Integrity
This test method provides various test conditions for determining the integrity of the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly processing...
July 1, 2011
Lead Integrity
This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part...
May 1, 2003
Lead Integrity
A description is not available for this item.
May 1, 2003
Lead Integrity
This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part...
JEDEC JESD 22-B105
January 1, 1999
Test Method B105-B Lead Integrity
A description is not available for this item.
January 1, 1988
Lead Integrity (Revision of Test Method B105 - Previously Published in JESD22-B)
A description is not available for this item.
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