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JEDEC JESD 51-7

High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

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Organization: JEDEC
Publication Date: 1 February 1999
Status: active
Page Count: 13
scope:

This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.

Document History

JEDEC JESD 51-7
February 1, 1999
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...

References

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