IPC/JPCA-6801
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
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| Organization: | IPC |
| Publication Date: | 1 January 2000 |
| Status: | active |
| Page Count: | 41 |
scope:
This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred to herein, is defined as the printed board that is built up progressively with the conductor layers and insulating layers using techniques such as plating and printing. The build-up/HDI PWBs include substrates for semiconductor packages.
Document History
IPC/JPCA-6801
January 1, 2000
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The...