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DS/EN 60317-36/A1

Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer

inactive
Organization: DS
Publication Date: 23 December 1999
Status: inactive
Page Count: 6
ICS Code (Wires): 29.060.10
scope:

This part of IEC 317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on thermoplastic resin. Class 180 is a thermal class that requires a minimum temperature index of 180 and a heat shock temperature of at least 200 °C.

Document History

July 29, 2019
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be...
March 10, 2014
Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be...
August 18, 2000
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
This part of IEC 317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may...
DS/EN 60317-36/A1
December 23, 1999
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
This part of IEC 317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may...
December 7, 1995
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
This part of IEC 317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may...
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be...
Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be...
Specifications for particular types of winding wires -- Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyester - imide resin, which...
Specifications for particular types of winding wires -- Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyester - imide resin, which...
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