DS/EN 60749-6/Corr.1
Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
inactive
| Organization: | DS |
| Publication Date: | 23 December 2003 |
| Status: | inactive |
| Page Count: | 3 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of this part of IEC 60749 is to test and determine the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test must be evaluated.
Document History
June 19, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
IEC 60749-6:2017(E) is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to...
DS/EN 60749-6/Corr.1
December 23, 2003
Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
The purpose of this part of IEC 60749 is to test and determine the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is...
August 26, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
The purpose of this part of IEC 60749 is to test and determine the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is...
Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
The purpose of this part of IEC 60749 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is...
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