IPC - TM-650 2.4.28A
Adhesion, Solder Mask (Non-Melting Metals)
inactive
| Organization: | IPC |
| Publication Date: | 1 August 1982 |
| Status: | inactive |
| Page Count: | 1 |
Document History
August 1, 1997
Adhesion, Solder Mask (Non-Melting Metals)
This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after...
TM-650 2.4.28A
August 1, 1982
Adhesion, Solder Mask (Non-Melting Metals)
A description is not available for this item.