scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function Shift in/out rate 01 (See 6.4) 64 × 5 CMOS parallel FIFO 10 MHz 02 (See 6.4) 64 × 5 CMOS parallel FIFO 15 MHz 03 (See 6,4) 64 × 5 CMOS parallel FIFO 25 MHz 04 (See 6.4) 64 × 5 CMOS parallel FIFO 35 MHz

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline S F-9 (20-lead, .540" × .300" × .100"), flat package V D-6 (18-lead, .960" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package K F-l0 (18-lead, .540" × .370" × .092"), flat package

Terminal voltage with respect to ground- - - - - - - −0.5 V dc to +7.0 V dc DC output current- - - - - - - - - - - - - - - - - - 50mA Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 1/- - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Cases S, V, X, and 2 - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature ,(T_J) - - - - - - - - - - - - - +175°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Supply voltage (GND) - - - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - - - 2.0 V dc minimum Input low voltage (V_IL)- - - - - - - - - - - - - - - 0.8 V dc maximum 2/ Case operating temperature range (T_C)- - - - - - - - −55°C to +125°C

intended Use: