NPFC - MIL-G-45204
GOLD PLATING, ELECTRODEPOSITED
inactive, Most Current
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| Organization: | NPFC |
| Publication Date: | 7 September 1983 |
| Status: | inactive |
| Page Count: | 14 |
Document History
June 22, 2023
Gold Plating, Electrodeposited
A description is not available for this item.
September 13, 2018
Gold Plating, Electrodeposited
A description is not available for this item.
December 3, 2013
Gold Plating, Electrodeposited
A description is not available for this item.
June 29, 2007
GOLD PLATING, ELECTRODEPOSITED
Gold plating is intended for electrical application, good corrosion resistance, good solderability, and other applications.
June 28, 2007
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
April 7, 1998
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
June 9, 1993
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
March 12, 1984
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
MIL-G-45204
September 7, 1983
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
June 7, 1983
GOLD PLATING, ELECTRODEPOSITED
This specification covers electroueposited gold plating on metallic surfaces.
Gold plating shall be furnished in the following types and classes as specified (see 6.2).
Type I - 99.7 percent gold...
February 26, 1971
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
October 15, 1969
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
March 27, 1969
GOLD PLATING, ELECTRODEPOSITED
Gold plating is intended for electrical application, good corrosion resistance, good solderability, and other appplications.
June 30, 1966
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
October 6, 1961
GOLD PLATING, ELECTRODEPOSITED
A description is not available for this item.
March 7, 1960
GOLD PLATING, ELECTRODEPOSITED
Gold plating provides a durable, tarnish-resistan finish intended primarily for engineering applications that require high electrical conductivity and per-manently low electical contact resistance.