BSI - BS 3934-5
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
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| Organization: | BSI |
| Publication Date: | 1 April 1992 |
| Status: | inactive |
| Page Count: | 15 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.
Document History
September 15, 1997
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
BS 3934-5
April 1, 1992
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage...
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