BSI - BS 4584-103.2
Metal-Clad Base Materials for Printed Circuits Part 103: Materials Used in Connection with Printed Circuits Section 103.2: Copper Foil for Use in the Manufacture of Copper-Clad Base Materials
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| Organization: | BSI |
| Publication Date: | 28 February 1990 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
For use in the manufacture of copper clad laminated sheets and of copper clad flexible materials used for printed wiring.
Document History
BS 4584-103.2
February 28, 1990
Metal-Clad Base Materials for Printed Circuits Part 103: Materials Used in Connection with Printed Circuits Section 103.2: Copper Foil for Use in the Manufacture of Copper-Clad Base Materials
For use in the manufacture of copper clad laminated sheets and of copper clad flexible materials used for printed wiring.
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