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CTA-556-C

Outer Shipping Container Label Standard

active, Most Current
Organization: CTA
Publication Date: 1 December 2005
Status: active

Document History

CTA-556-C
December 1, 2005
Outer Shipping Container Label Standard
A description is not available for this item.
CTA-556-B
November 1, 1999
Outer Shipping Container Bar Code Label Standard
This document provides instructions for producing and applying labels containing bar code symbols or labels containing bar code and two-dimensional symbols on outer shipping containers. A brief...
EIA-556-B
November 1, 1999
Outer Shipping Container Label Standard
This document provides instructions for producing and applying labels containing bar code symbols or labels containing bar code and two-dimensional symbols on outer shipping containers. A brief...
556-A
January 1, 1992
Electronic Industries Association-Outer Shipping Container Bar Code Label Standard
A description is not available for this item.

References

This document is referenced by:
IEC TS 62686-1 - Process management for avionics – Electronic components for aerospace, defence and high performance (ADHP) applications – Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by IEC on April 1, 2020
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete...
This document is referenced by:
JEDEC JEP 70 - Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
Published by JEDEC on October 1, 2013
This publication contains a listing and description of commonly used quality and reliability related publications applicable to the semiconductor industry. It is intended to be a reference aid in...
This document is referenced by:
EIA-481 - 8 mm Through 200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling
Published by ECIA on January 1, 2015
This Standard covers requirements for taping surface mount components. Complementary standards for specialized taping requirements are included in the addendum.
This document is referenced by:
EIA-296 - Lead Taping of Components in Axial Lead Configuration for Automatic Handling
Published by ECIA on April 1, 2000
This Standard includes the lead taping requirements for components having axial configured leads, provided these components may be taped in accordance with the requirements of this document.
This document is referenced by:
EIA-887-B - Resistors, Thin Film Array on Silicon - Molded
Published by ECIA on October 1, 2023
Introduction This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
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