BSI - BS 5909
Method for Scale adhesion test for oxygen-free copper
active, Most Current
Buy Now
| Organization: | BSI |
| Publication Date: | 30 April 1980 |
| Status: | active |
| Page Count: | 6 |
| ICS Code (Other methods of testing of metals): | 77.040.99 |
scope:
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
Document History
BS 5909
April 30, 1980
Method for Scale adhesion test for oxygen-free copper
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring...
References
Related Products
Searching for related products...