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CENELEC - EN 61189-2

Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials and Interconnection Structures

inactive
Organization: CENELEC
Publication Date: 1 April 1997
Status: inactive
Page Count: 128
ICS Code (Printed circuits and boards): 31.180

Document History

September 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 2: Test Methods for Materials and Interconnection Structures
A description is not available for this item.
EN 61189-2
April 1, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials and Interconnection Structures
A description is not available for this item.
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