CENELEC - EN 61189-2
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials and Interconnection Structures
inactive
Organization: | CENELEC |
Publication Date: | 1 April 1997 |
Status: | inactive |
Page Count: | 128 |
ICS Code (Printed circuits and boards): | 31.180 |
Document History
September 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 2: Test Methods for Materials and Interconnection Structures
A description is not available for this item.
EN 61189-2
April 1, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials and Interconnection Structures
A description is not available for this item.