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BSI - BS EN 60127-4

Miniature fuses Part 4: Universal modular fuse-links (UMF) Through-hole and surface mount types

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Organization: BSI
Publication Date: 14 November 2005
Status: inactive
Page Count: 34
ICS Code (Fuses and other overcurrent protection devices): 29.120.50

Document History

23/30482652 DC
November 15, 2023
Draft BS EN IEC 60127-4 Miniature fuses Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
A description is not available for this item.
BS EN 60127-4
November 14, 2005
Miniature fuses Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
A description is not available for this item.
BS EN 60127-4
November 14, 2005
Miniature fuses Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
A description is not available for this item.
BS EN 60127-4
November 14, 2005
Miniature fuses Part 4: Universal modular fuse-links (UMF) Through-hole and surface mount types
A description is not available for this item.
BS EN 60127-4
October 15, 1998
Miniature Fuses - Part 4: Universal Modular Fuse-Links (UMF)
A description is not available for this item.
BS EN 60127-4
October 15, 1998
Miniature fuses Part 4: Universal Modular Fuse-links (UMF)
Relates to UMF for printed circuits and other substrate systems, used for protection of electric appliances, electronic equipment and components.
BS EN 60127-4
October 15, 1998
Miniature fuses Part 4: Universal Modular Fuse-links (UMF)
A description is not available for this item.
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References

This document references:
BS EN 61249-2-7 - Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Published by BSI on August 19, 2002
A description is not available for this item.
This document references:
IEC 60068-2-21 - Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices
Published by IEC on January 1, 2012
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
BS EN IEC 60068-2-21 - Environmental testing Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by BSI on September 30, 2021
A description is not available for this item.
This document references:
IEC 61191-2 - PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
Published by IEC on September 1, 2019
A description is not available for this item.
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