|Publication Date:||1 January 2006|
This specification covers the requirements for electrodeposited copper.
This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.
Plating covered by this specification is classified as follows:
Type 1 - Engineering plating
Type 2 - Plating for masking
Type 1 shall be supplied if no class is specified.