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DOD - DESC-DWG-85136

HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY

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Organization: DOD
Publication Date: 14 July 1993
Status: inactive
Page Count: 12
scope:

This drawing describes the requirements for a family of aluminum alloy fin stock heat sinks for use with electronic components.

The complete PIN shall be as shown in the following example:

intended Use:

Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM... View More

Document History

DESC-DWG-85136
February 23, 2010
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM...
DESC-DWG-85136
July 14, 1993
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM...
DESC-DWG-85136 REV C
August 13, 1990
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
A description is not available for this item.
DESC-DWG-85136 REV B
September 30, 1988
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
A description is not available for this item.
DESC-DWG-85136 REV A
May 12, 1987
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
A description is not available for this item.
DESC-DWG-85136
September 10, 1986
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
A description is not available for this item.
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References

This document references:
ASME B46.1 - Surface Texture (Surface Roughness, Waviness, and Lay)
Published by ASME on January 1, 2019
This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying...
This document references:
MIL-DTL-19491 - SEMICONDUCTOR DEVICES, PACKAGING OF
Published by NPFC on March 17, 2021
Scope. This specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes (FSC 5961) (see 6.1).
This document references:
MIL-STD-202 - TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS
Published by NPFC on February 6, 1956
A description is not available for this item.
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