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JEDEC JEP 149

Application Thermal Derating Methodologies

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Organization: JEDEC
Publication Date: 1 November 2004
Status: inactive
Page Count: 18
scope:

This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies. 

Document History

JEDEC JEP 149
January 1, 2021
Application Thermal Derating Methodologies
This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such...
JEDEC JEP 149
November 1, 2004
Application Thermal Derating Methodologies
This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such...

References

This document is referenced by:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
MIL-STD-11991 - GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
Published by NPFC on August 26, 2015
This standard establishes the requirements for parts, materials, and processes (PM&P) for use during the development, production, and sustainment of military systems. These requirements directly...
This document is referenced by:
IEC TS 62564-1 - Process management for avionics – Aerospace qualified electronic components (AQEC) – Part 1: Integrated circuits and discrete semiconductors
Published by IEC on July 1, 2016
This part of IEC 62564, which is a Technical Specification, defines the minimum requirements for integrated circuits and semiconductors which are designated as an “aerospace qualified electronic...
This document is referenced by:
IEC 60317-2 - Specifications for particular types of winding wires – Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
Published by IEC on August 1, 2019
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may...
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