IPC - TM-650 2.4.21D
Land Bond Strength, Unsupported Component Hole
inactive
| Organization: | IPC |
| Publication Date: | 1 August 1997 |
| Status: | inactive |
| Page Count: | 2 |
Document History
January 1, 2007
Land Bond Strength, Unsupported Component Hole
This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
May 1, 2004
Land Bond Strength, Unsupported Component Hole
This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
TM-650 2.4.21D
August 1, 1997
Land Bond Strength, Unsupported Component Hole
A description is not available for this item.
November 1, 1988
Terminal Pull Strength, Rigid Printed Wiring Board
A description is not available for this item.