DIN EN 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 June 2001 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-3
June 1, 2001
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
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