scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 8572 Real time clock

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and Qualification to MIL-M-38510 Q or V Certification and Qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "XI" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - −0.5 V to +7.0 V DC input voltage range (V_IN) - - - - - - - - - - - - - - - - −0.5 V to V_CC + 0.5 V DC output voltage range (V_OUT) - - - - - - - - - - - - - - −0.5 V to V_CC + 0.5 V Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - ±260°C Junction temperature (T_J)- - - - - - - - - - - - - - - - - - ±150°C Power dissipation (P_D) - - - - - - - - - - - - - - - - - - - 500 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA) - - - - - - - 46°C/W board mount - - - - - - - - - 52°C/W socket mount

Supply voltage (V_CC) 2/ - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Supply voltage (V_BB) (Battery-backed mode) 2/ - - - - - - 2.2 V to V_CC − 0.4 V DC input or output voltage (V_IN,V_OUT) - - - - - - - - - - 0.0 v to V_CC Case operating temperature range (T_C) - - - - - - - - - - −55°C to + 125°C Address hold after read (t_RAH) - - - - - - - - - - - - - 3 ns (minimum) Address hold after write strobe (t_WAH) - - - - - - - - - - 3 ns minimum) Data hold after write strobe (t_WDH) - - - - - - - - - - - 3 ns (minimum)

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - XX percent 3/

intended Use: