IPC - TM-650 2.4.40
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 October 1987 |
| Status: | active |
| Page Count: | 1 |
scope:
This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric.
Document History
TM-650 2.4.40
October 1, 1987
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric.