scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 PAL18PBA 18-input, 8-output AND-OR programmable array logic 02 PAL18P88 18-input, 8-output AND-OR programmable array logic 03 PAL18P8AL 18-input, 8-output AND-OR programmable array logic 04 PAL18P8L 18-input, 8-output AND-OR programmable array logic 05 PAL18P8Q 18-input, 8-output AND-OR programmable array logic

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, ¼" × 1-1/16"), dual-in-line package S F-9 (20-lead, ¼" × ½"), flat package 2 C-2 (20-terminal, .350" × .350"), square chip carrier package

Supply voltage range- - - - - - - - - - - - - - - −0.5 V to +7.0 V 2/ Input voltage range - - - - - - - - - - - - - - - −0.5 V to +5.5 V Output voltage applied - - - - - - - - - - - - - −0.5 V to +7.0 V 2/ Output sink current - - - - - - - - - - - - - - - −90 mA 2/ Thermal resistance, junction-to-case (θ_JC): Cases R and S - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case 2 - - - - - - - - - - - - - - - - - - - - 15 C/W 3/ Maximum power dissipation (P_D) 4/ - - - - - - - - 1.2 W Maximum junction temperature (T_J) - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum)- +260°C Storage temperature - - - - - - - - - - - - - - - −65°C to +150°C

Supply voltage (V_CC) - - - - - - - - - - - - - - 4.5 V to 5.5 V High-level input voltage (V_IH) - - - - - - - - - 2.0 V (minimum) Low-level input voltage (V_IL) - - - - - - - - - 0.8 V (maximum) Case operating temperature range - - - - - - - - −55°C to +125°C

intended Use: