AFNOR - NF EN 60749-22
Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength
active, Most Current
| Organization: | AFNOR |
| Publication Date: | 1 November 2003 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
NF EN 60749-22
November 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength
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