UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.6.7

Thermal Shock and Continuity (Flexible Printed Wiring)

inactive
Organization: IPC
Publication Date: 1 April 1973
Status: inactive
Page Count: 2

Document History

August 1, 1997
Thermal Shock & Continuity, Printed Board
The purpose of this method is to determine the physical endurance of printed boards to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these extremes. The...
TM-650 2.6.7
April 1, 1973
Thermal Shock and Continuity (Flexible Printed Wiring)
A description is not available for this item.
Advertisement