IPC-TR-578

Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards

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Organization: IPC
Publication Date: 1 September 1984
Status: active
Page Count: 100
scope:

OBJECTIVE

The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:

  • To evaluate the state-of-the-art in the international printed wiring board industry for fabrication of high density, double sided, rigid bare copper boards.
  • Collect data on different manufacturing methods and substrates used to fabricate printed wiring boards.
  • Include all recognized printed wiring board manufacturing methods: i.e., subtractive, thin foil, semi-additive and fully-additive.
  • Determine the reliability and quality of the boards producedu sing recognized industry testing practices and procedures.

Document History

IPC-TR-578
September 1, 1984
Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards
OBJECTIVE The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives: To evaluate...

References

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