scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 2004 512 × 8 bit, nonvolatile static RAM 250 ns 02 2004 512 × 8 bit, nonvolatile static RAM 300 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-10 (28-lead, .600" row spacing) dual-in-line package Y C-12 (32-terminal, .560" × .458" × ,120") rectangular chip carrier package

Temperature under bias - - - - - - - - - - - - - - - −65°C to +135°C Storage temperature- - - - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - −1.0 V to +7.0 V dc DC output current- - - - - - - - - - - - - - - - - - 5.0 mA Lead temperature (soldering, 10 seconds) - - - - - - 300°C Power dissipation (P_D) - - - - - - - - - - - - - - - 0.75 W Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - 200°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Minimum high level input voltage (V_IH) - - - - - - +2.3 V dc Maximum high level input voltage (V_IH) - - - - - - +V_CC + 0.5 V dc Minimum low level input voltage (V_IL) - - - - - - - −0.5 V dc Maximum low level input voltage (V_IL) - - - - - - - +0.8 V dc Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

intended Use: