UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.5.6B

Dielectric Breakdown of Rigid Printed Wiring Material

active, Most Current
Organization: IPC
Publication Date: 1 May 1986
Status: active
Page Count: 3
scope:

This method describes a procedure for determining the ability of rigid insulating material to resist breakdown parallel to laminations (or in the plane of the material) when subjected to extremely high voltages at standard AC power frequencies of 50-60Hz.

As for most electrical properties, values obtained on most materials are highly dependent on the moisture content and tests using different conditioning cannot be compared. Tests in other mediums, e.g. air are generally impractical due to its relatively low breakdown.

This method is based on the test technique described as ASTM D229.

Document History

TM-650 2.5.6B
May 1, 1986
Dielectric Breakdown of Rigid Printed Wiring Material
This method describes a procedure for determining the ability of rigid insulating material to resist breakdown parallel to laminations (or in the plane of the material) when subjected to extremely...

References

Advertisement