scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX641AM Fixed output 10 W CMOS step-up switching regulators

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage, (V_OUT) . . . . . . . . . . . . . . . . +18 V Output voltage, (LX, LBO) . . . . . . . . . . . . . . . +18 V Input voltage, (LBI, LBO, VFB, COMP) . . . . . . . . . − 0.3 V to (V_OUT + 0.3 V) LX output current . . . . . . . . . . . . . . . . . . . 450 mA peak LBO output current . . . . . . . . . . . . . . . . . . 50 mA Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . 300°C Continuous power dissipation, T_A = 70°C (P_D): Derate linearly 8.00 mW/°C above +70°C . . . . . . . 640 mW Thermal resistance, junction-to-case (Θ_JC): . . . . . . 55°C/W Thermal resistance, junction-to-ambient (Θ_JA): . . . . 125°C/W

Ambient operating temperature range (T_A) . . . . . . . −55°C to +125°C Supply voltage range (V_S) . . . . . . . . . . . . . . . 2.4 V dc to 16.5 V dc Output voltage range (V_OUT) . . . . . . . . . . . . . . 2.4 V dc to 16.5 V dc

intended Use: