CENELEC - EN 60191-6-12
Mechanical Standardization of Semiconductor Devices Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages Design Guide for Fine-Pitch Land Grid Array (FLGA) Rectangular Type
inactive
| Organization: | CENELEC |
| Publication Date: | 1 July 2002 |
| Status: | inactive |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
August 1, 2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
EN 60191-6-12
July 1, 2002
Mechanical Standardization of Semiconductor Devices Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages Design Guide for Fine-Pitch Land Grid Array (FLGA) Rectangular Type
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