DLA - SMD-5962-92284
MICROCIRCUIT, DIGITAL, CMOS, 32-BIT RISC MICROPROCESSOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 March 1993 |
| Status: | active |
| Page Count: | 27 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Speed 01 29000 32 Bit streamlined instruction processor 20 MHz 02 29000 32 Bit streamlined instruction processor 16 MHz
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style Z CMGA9-P169 169 Pin grid array
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input voltage range . . . . . . . . . . . . . . . . . . . −0.5 to VCC +0.5 V dc Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (PD) 2/. . . . . . . . . . . . . . 3.3 W Lead temperature (soldering, 10 seconds) . . . . . . . . . 300°C Thermal resistance, junction-to-case (θJC): Case Z . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . . . 131.6°C
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum high-level input voltage (VIH) . . . . . . . . . . 2.0 V dc Maximum low-level input voltage (VIL) . . . . . . . . . . 0.8 V dc Case operating temperature range (TC) . . . . . . . . . . −55°C to +125°C Maximum low-level SYSCLK input voltage (VILSYSCLK) . . . . . . . . . . . . . . . . . . . . . . +0.8 V dc Minimum high-level SYSCLK input voltage (VIHSYSCLK) . . . . . . . . . . . . . . . . . . . . . . VCC − 0.8 V dc
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 3/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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