MSFC-PROC-3260
REPAIR OF LIFTED SOLDER PADS AND CONDUCTORS ON PRINTED WIRING BOARDS
| Organization: | MSFC |
| Publication Date: | 1 May 2002 |
| Status: | inactive |
| Page Count: | 9 |
scope:
This repair instruction specifies the materials, equipment, procedures, controls and quality acceptance criteria to be used for the repair of lifted pads and conductors on printed wiring assemblies.
Purpose. This repair shall be used only for assembled printed wiring boards (printed wiring assemblies). It shall not be used to repair printed wiring boards prior to installation of piece parts (components).
Applicability. This repair instruction shall only be used when authorized by a Material Review Board (MRB) action. The Discrepancy Record (DR) shall specify the type of damage and area to be repaired. All fabrication and inspection accomplished in conjunction with this repair procedure shall be performed by personnel holding a valid certification in accordance with NASA-STD-8739.1, "Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies" as amended by MSFC-STD-2906, "MSFC Tailoring Guide For NASA-STD-8739.1, Workmanship Standard For Staking And Conformal Coating Of Printed Wiring Boards And Electronic Assemblies."
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