DS/ENV 50219
Description of the Reliability test structures of the European mini test chip
inactive, Most Current
| Organization: | DS |
| Publication Date: | 14 August 1997 |
| Status: | inactive |
| Page Count: | 40 |
| ICS Code (Integrated circuits. Microelectronics): | 31.200 |
scope:
The test structures described here are suitable for technologies up to three metal layers. The test structures must have experienced all process steps including the final passivation to ensure all possible influences of different process steps (e.g. temperature profiels, radiation damage) are included. Structures for highly accelerated stress tests are included as well as conventional reliability structurs to determine lifetimes by means of common reliability models.
Document History
DS/ENV 50219
August 14, 1997
Description of the Reliability test structures of the European mini test chip
The test structures described here are suitable for technologies up to three metal layers. The test structures must have experienced all process steps including the final passivation to ensure all...