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IEC 61280-2-4

Fibre Optic Communication Subsystem Basic Test Procedures - Part 2-4: Test Procedures for Digital Systems - Bit-Rate Tolerance Measurement

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Organization: IEC
Publication Date: 1 May 1998
Status: inactive
Page Count: 26
ICS Code (Fibre optic systems in general): 33.180.01

Document History

IEC 61280-2-4
May 1, 1998
Fibre Optic Communication Subsystem Basic Test Procedures - Part 2-4: Test Procedures for Digital Systems - Bit-Rate Tolerance Measurement
A description is not available for this item.

References

This document is referenced by:
EN 61291-4 - Optical amplifiers - Part 4: Multichannel applications - Performance specification template
Published by CENELEC on March 1, 2012
This part of IEC 61291 applies to optical amplifier (OA) devices and sub-systems to be used in multichannel applications. For single channel applications, use IEC 61291-2. The object of this...
This document is referenced by:
BS EN 61287-1 - Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
Published by BSI on September 30, 2014
A description is not available for this item.
This document is referenced by:
CEI EN 62150-2 - Fibre optic active components and devices - Test and measurement procedures Part 2: ATM-PON transceivers
Published by CEI on April 1, 2012
This part of IEC 62150 specifies testing and measuring procedures for fibre optic transceivers for asynchronous-transfer-mode passive optical network (ATM-PON) systems recommended by ITU-T G.983.1....
This document is referenced by:
IEC 62148-15 - Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
Published by IEC on March 1, 2021
This part of IEC 62148 covers the physical dimension and interface specifications for discrete vertical cavity surface emitting laser (VCSEL) devices in optical telecommunication and optical data...
This document is referenced by:
IPC-0040 - Optoelectronics Assembly and Packaging Technology
Published by IPC on May 1, 2003
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component...
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