DLA - SMD-5962-92141
MICROCIRCUIT, LINEAR, CMOS, FIXED/ADJUSTABLE, LOW POWER, STEP-UP SWITCHING REGULATOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 19 November 1992 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Output voltage (VOUT) . . . . . . . . . . . . . . . . . . 18.0 V dc Output voltage (LX, LBO) . . . . . . . . . . . . . . . . 18.0 V dc Input voltage (LBI, VFB) . . . . . . . . . . . . . . . . −0.3 V to (+VOUT + 0.3 V) Output current (LX) . . . . . . . . . . . . . . . . . . . 450 mA peak Output current (LBO) . . . . . . . . . . . . . . . . . . 50 mA Power dissipation: Up to +70°C . . . . . . . . . . . . . . . . . . . . . . 640 mW Derate above +70°C . . . . . . . . . . . . . . . . . . 8 mW/°C Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA) . . . . . . 125°C/W Junction temperature (TJ) . . . . . . . . . . . . . . . . +150°C
Input voltage range (VIN) . . . . . . . . . . . . . . . . 2.4 V dc to 16.5 V dc Output voltage range (VOUT) . . . . . . . . . . . . . . . 2.4 V dc to 16.5 V dc Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits... View More
Document History
