scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 4013-10 13000 gate programmable array 10 ns 02 4013-6 13000 gate programmable array 6 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA10-P223 223 Pin grid array package Y see figure 1 228 Quad flat package Z see figure 1 228 Quad flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range to ground potential (V_CC) . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . −0.5 V dc to V_CC + 5.0 V dc Voltage applied to three-state output (V_IS) . . . . . −0.5 V dc to V_CC + 5.0 V dc Thermal resistance, junction-to case (θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA) . . . . +50°C/W Power dissipation (P_D) . . . . . . . . . . . . . . . . 2.0 W Junction temperature (T_J) . . . . . . . . . . . . . . +150°C 3/ Lead temperature (soldering, 10 seconds) . . . . . . . +260°C Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C

Supply voltage relative to ground (V_CC) . . . . . . . +4.5 V dc minimum to +5.5 V dc maximum Input high voltage (V_IH) . . . . . . . . . . . . . . . 2.0 V dc to V_CC Input low voltage (V_IL) . . . . . . . . . . . . . . . 0 V dc to 0.8 V dc Maximum input signal transition time (t_IN) . . . . . . 250 ns Case operating temperature range (T_C) . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . 4/ percent

intended Use: