scope:

This standard establishes design requirements governing printed-wiring electrical backplane assemblies consisting of rigid printed-wiring boards in accordance with MIL-P-55110 on which separately manufactured connector component parts qualified in accordance with MIL-C-28859 have been added. The design criteria (such as printed-wiring board thickness) contained in this standard are predicated on the requirement that end item assemblies are conformal coated or solder masked.

The rigid printed-wiring board may be used to distribute power and ground throughout the backplane and provide internal point-to-point circuit connections. Compliant components may be selected which have wrappost tails protruding beyond the lower surface of the printed-wiring electrical backplane and may also be used to provide external point to point circuit connections. It is the intent for these assemblies that no other media other than the compliant feature is required for mechanical or electrical attachment of the MIL-C-28859 components to the rigid printed wiring boards. This standard takes precedence regarding compliant features as an acceptable means of interlayer/interfacial interconnect for printed wiring board assemblies.

Printed-wiring backplane assemblies shall be of the following types:

(a) Type 2 - Double-sided.

(b) Type 3 - Multilayer.

intended Use:

This standard specifies what should be incorporated into backplane design.