scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC00 Quad 2-input NAND gate

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-T14 14 Flat pack B GDFP4-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP2-F14 or CDFP3-F14 14 Flat pack 2 CQCC1-N20 or CQCC2-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)...................................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN).................................................... −0.5 V dc to V_CC +0.5 V dc DC output voltage range (V_OUT).................................................. −0.5 V dc to V_CC +0.5 V dc Clamp diode current (I_IK)....................................................... ±20 mA DC output diode current (I_OK) (per pin)......................................... ±25 mA DC V_CC or GND current (per pin)................................................. ±50 mA Storage temperature range (T_STG)................................................ −65°C to + 150°C Maximum power dissipation (P_D):................................................. 500 mW 4/ Lead temperature (soldering, 10 seconds)........................................ +260°C Thermal resistance, junction-to-case (θ_JC)................................. See MIL-STD-1835 Junction temperature (T_J)....................................................... +175°C 5/

Supply voltage range (V_CC) ..................................................... +2.0 V dc to +6.0 V dc Case operating temperature range (T_C) .......................................... −55°C to + 125°C Input rise or fall time t_r, t_f): V_CC = 2.0 V ................................................................... 0 to 1,000 ns V_CC = 4.5 V ................................................................... 0 to 500 ns V_CC = 6.0 V ................................................................... 0 to 400 ns

intended Use: