The cleaning compound is intended for use in the cleaning of avionics components not harmed by water. This includes, but is not limited to, most printed circuit boards and electrical motors. The cleaning compound may be used in static immersion, immersion with mechanical agitation, and ultrasonic applications. It is not intended to be used in high-pressure spray cabinets or vapor degreasing equipment. This cleaning compound is intended to be mixed in the ratio of 1 part cleaner concentrate to 9 to 10 parts water and used at a temperature of 140°F.